Reliable Low-Cost Encapsulation and Barrier Tech
Demonstrating New Concepts for Reliable Low-Cost Module Encapsulation and Barrier Technologies
Recipient Stanford University(PI: Dauskardt, Reinhold H.)
Abstract This project is a focused thrust to advance new concepts in solar module encapsulation and barrier technologies to accelerate module performance, reliability and manufacturability. We use two scalable approaches: 1) demonstrate the role of “size effects” on salient material and interfacial properties important for reliability of new module materials, and 2) develop atmospheric plasma capabilities to deposit organosilicate and oxide/nitride barrier film structures with controlled properties. We will coordinate with scientists from SLAC to perform advanced characterization.